3D Packaging & Heterogeneous Integration Engineer

GlobalFoundries; Town of Malta (NY); On-site; USD 65,000 - 146,000; Full time

Job summary

GlobalFoundries Fab8 in Malta, New York, seeks an R&D design enablement engineer to advance 3D heterogeneous integration efforts for next-generation packaging R&D. You will work on wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development, interfacing with DM/PDK teams and customers.

The role requires a PhD with defended thesis or a Master’s in Electrical Engineering and Materials Science (or related field), a 3.0 GPA, and English fluency. Travel up to 10% is expected.

Qualifications

• Education – PhD with completed defended thesis or Master’s in Electrical Engineering and Materials Science or related field from an accredited degree program.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency - English (Written & Verbal).
• Travel - Up to 10%.

Responsibilities

• Publish Design Manual (DM) specifications based on failure modes identified for packaging required by the product lines in partnership with the unit process and R&D engineers.
• DM is a collection of all technology restrictions (geometry rules, electrical rules, etc.) that must be followed for an integrated circuit (IC) design to be manufacturable.
• Advanced packaging liaison to the DM and PDK (Process Design Kit) teams to translate packaging requirements to a device enablement specification covering: design rules, library device(TSV) layouts, layout vs schematic(LVS) requirements, device model terminals.
• Develop expertise in drafting test vehicle content specifications and the associated tapeout process (including mask reviews).
• Develop expertise in drafting test specifications for test vehicle content (macros); engage with the test teams (inline and lab) to ensure alignment on test requests.
• Collaborate with vendors and OSATs (Outsourced Assembly and Test) on design (test vehicles, masks).
• Facilitate advanced packaging design interactions between the product lines/fab teams and customers.
• Work and collaborate with other teams regarding different assignments as needed.

Skills

English proficiency

Leadership

Project management

Education

PhD with defended thesis

Master's in Electrical Engineering and Materials Science

Job description

GlobalFoundries Fab8 in Malta, New York, seeks an R&D design enablement engineer to advance 3D heterogeneous integration efforts for next-generation packaging R&D. You will work on wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development, interfacing with DM/PDK teams and customers.

The role requires a PhD with defended thesis or a Master’s in Electrical Engineering and Materials Science (or related field), a 3.0 GPA, and English fluency. Travel up to 10% is expected.