Lead 3D Heterogeneous Integration Engineer

Global Foundries

Town of Malta (NY)

On-site

USD 98,000 - 176,000

Full time

13 days ago

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Job summary

GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) and lead 3D-Heterogeneous Integration initiatives, including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development.

You will work with fab and vendor teams to drive end-to-end integration, enable rapid prototyping, and push advanced packaging capabilities across multiple programs. Strong DOE and communication skills are essential.

Qualifications

  • MS/PhD in a relevant engineering field with strong academic performance (GPA 3.0+).
  • Strong problem solving and troubleshooting skills including DOE capabilities.
  • Fluency in English (written & verbal).
  • Travel up to 20% for project collaboration and customer-facing activities.

Responsibilities

  • Drive 3D-HI process development for advanced packaging building blocks.
  • Address power density and thermal challenges at package level.
  • Collaborate with unit process engineers, vendors, and fab teams.
  • Lead joint development projects for 2.5D/3D HI processes.
  • Drive end-to-end process integration and planning for prototyping.
  • Develop expertise in materials, processes and tooling; optimize characterization resources.
  • Analyze data, interpret results, and resolve integration issues; generate IP related to wafer integration.

Skills

Problem solving
DOE design of experiments
Team collaboration

Education

Master's in Electrical Engineering
PhD preferred in related field

Job description

GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) and lead 3D-Heterogeneous Integration initiatives, including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development.

You will work with fab and vendor teams to drive end-to-end integration, enable rapid prototyping, and push advanced packaging capabilities across multiple programs. Strong DOE and communication skills are essential.

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