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GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) and lead 3D-Heterogeneous Integration initiatives, including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development.
You will work with fab and vendor teams to drive end-to-end integration, enable rapid prototyping, and push advanced packaging capabilities across multiple programs. Strong DOE and communication skills are essential.
GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) and lead 3D-Heterogeneous Integration initiatives, including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development.
You will work with fab and vendor teams to drive end-to-end integration, enable rapid prototyping, and push advanced packaging capabilities across multiple programs. Strong DOE and communication skills are essential.