Lead 3D-HI Packaging Engineer

GlobalFoundries; New York (NY); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries in the United States seeks an experienced R&D engineer for the Advanced Packaging Lab (APL) to lead 3D-Heterogeneous Integration initiatives across multiple domains. You will drive BEOL-process development, engage with vendors, and guide cross-functional teams through 2.5D/3D integration projects.

The role requires a Master’s degree with 4–5 years of related work, strong DOE and data-analysis skills, and English fluency.

Qualifications

• Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
• MS degree with at least 4–5 years of prior related work experience.
• In-depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
• Strong problem solving and technical troubleshooting skills including expertise in design of experiment.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency - English (Written & Verbal).
• Travel - Up to 10%.

Responsibilities

• Drive 3D-HI process development efforts for building blocks for advanced packaging solutions.
• Collaborate with unit process engineers, manufacturing engineers, and vendors for GlobalFoundries fabs.
• Lead joint development projects on 2.5D and 3D HI processes.
• Drive end-to-end process integration and planning for new capabilities and prototyping.
• Develop expertise in processes, materials, and tooling; optimize characterization resources.
• Drive data analysis, interpret results, and understand failure modes.
• Identify and resolve process integration issues and related challenges.
• Generate IP related to wafer integration and packaging technology.

Skills

BEOL processes

3D integration

Experiment design

Data analysis

English fluency

Education

Master's in Electrical/Mechanical/Chemical Eng., Materials Science

MS with 4-5 years experience

PhD preferred

Tools

Wafer bonding equipment

Test/probe equipment

Process characterization tools

Job description

GlobalFoundries in the United States seeks an experienced R&D engineer for the Advanced Packaging Lab (APL) to lead 3D-Heterogeneous Integration initiatives across multiple domains. You will drive BEOL-process development, engage with vendors, and guide cross-functional teams through 2.5D/3D integration projects.

The role requires a Master’s degree with 4–5 years of related work, strong DOE and data-analysis skills, and English fluency.