3D IC Packaging & Integration Co-op

Global Foundries; Town of Malta (NY); On-site; USD 33,000 - 55,000; Full time

Job summary

GlobalFoundries is seeking an in-plant 3D Heterogeneous Integration Development Intern in the United States. You will work with engineering teams on advanced packaging processes, perform DOEs, analyze data, and build models to improve integration performance.

The internship offers mentorship, exposure to wafer-to-wafer bonding, TSV/TOV, and interposer technologies, and collaboration with internal and external partners. Expect a 40-hour work week, up to 10% travel, and a competitive wage.

Qualifications

• Education: Sophomore or higher pursuing degree with >=3.0 GPA.
• English fluency, written & verbal.
• Willingness to travel up to 10%.

Responsibilities

• Plan and perform DOE using internal tooling and external partners.
• Analyze engineering data from experiments and process optimizations.
• Develop or support process models for advanced packaging and integration.
• Assist with daily integration, documentation, and problem solving.
• Collaborate with cross-functional teams to support project objectives.
• Summarize results and communicate findings to stakeholders.

Skills

DOE design of experiments

Data analysis

Process modeling

Experimentation

Team collaboration

Documentation

Communication

Leadership (early)

Education

Bachelor’s or Master’s in Electrical/Mechanical/Chemical/Materials Science or related

Tools

Semiconductor tools

External partner equipment

Job description

GlobalFoundries is seeking an in-plant 3D Heterogeneous Integration Development Intern in the United States. You will work with engineering teams on advanced packaging processes, perform DOEs, analyze data, and build models to improve integration performance.

The internship offers mentorship, exposure to wafer-to-wafer bonding, TSV/TOV, and interposer technologies, and collaboration with internal and external partners. Expect a 40-hour work week, up to 10% travel, and a competitive wage.