Senior 3D/2.5D Heterogeneous Packaging Engineer

GLOBALFOUNDRIES U.S. 2 LLC; Essex Junction (VT); On-site; USD 118,000 - 210,000; Full time

Job summary

GlobalFoundries is seeking a senior engineer for chiplet-based 2.5D/3D integration across silicon, glass and mold interposers, including embedded silicon bridges. You will own end-to-end integration and work with fabrication, design, and reliability teams.

The role emphasizes leadership, innovation, and collaboration with external partners to advance heterogeneous integration capabilities for multiple programs. Requires 10+ years of related experience and an MS degree.

Qualifications

• Master’s in Electrical/related field from an accredited program.
• MS degree with 10+ years of related work experience.
• In-depth BEOL and 2.5D/3D integration knowledge including RDL/UBM metallization, wafer thinning, wafer test/probe, OSAT collaboration, package development & assembly.
• Strong problem-solving, DOE, statistical analysis, yield/reliability learning.

Responsibilities

• Lead 2.5D/3D advanced packaging platform integration strategy and readiness, including interface requirements and co-optimization with fabrication and assembly constraints.
• Partner with cross-functional teams and vendors for GlobalFoundries fabs.
• Collaborate on joint development projects to advance 2.5D/3D heterogeneous integration processes and track deliverables.
• Drive end-to-end process integration and planning for new capabilities and prototyping.
• Own integration risk assessment and develop reliability strategy; conduct root-cause analyses.
• Promote technical innovation via patents, publications, and robust integration methodologies.

Skills

BEOL processes expertise

2.5D/3D packaging integration

RDL/UBM metallization

Wafer thinning/backside processing

Wafer test/probe

OSAT collaboration

Statistical analysis

Design of experiments

Technical leadership

English communication

Education

Master’s degree in Electrical Engineering or related field

PhD preferred with 8+ years experience

Job description

GlobalFoundries is seeking a senior engineer for chiplet-based 2.5D/3D integration across silicon, glass and mold interposers, including embedded silicon bridges. You will own end-to-end integration and work with fabrication, design, and reliability teams.

The role emphasizes leadership, innovation, and collaboration with external partners to advance heterogeneous integration capabilities for multiple programs. Requires 10+ years of related experience and an MS degree.