Senior 3D Heterogeneous Integration Engineer

GlobalFoundries; Essex Junction (VT); On-site; USD 98,000 - 176,000; Full time

Job summary

GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) at Fab8 in Vermont. You will lead 3D-Heterogeneous Integration (3D-HI) initiatives including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development, driving end-to-end process integration across multiple programs.

The role requires a Master’s degree in engineering with 5–6 years of related experience, deep BEOL/TSV knowledge, and strong problem-solving and communication skills.

Qualifications

• Master’s degree in engineering from an accredited program.
• Minimum of 5–6 years of related work experience.
• Deep BEOL process knowledge and integration including advanced bonding, TSVs, bump/wafer finish, OSAT collaboration.
• English language proficiency.
• Willingness to travel up to 20%.

Responsibilities

• Drive 3D-HI process development for advanced packaging building blocks.
• Address power density and thermal management in next‑gen semiconductor products.
• Collaborate with process, manufacturing, and vendor teams for Fab8.
• Lead joint development with partners on 2.5D and 3D HI processes.
• Coordinate end-to-end process integration and prototyping across programs.
• Develop expertise in materials, tooling, and characterization resources.
• Analyze data, interpret results, and identify failure modes.
• Identify and resolve process integration challenges.
• Generate IP related to wafer integration and packaging technology.

Skills

Problem solving

Troubleshooting

Data analysis

English fluency

Education

Master’s degree in Electrical/Mechanical/Chemical/Materials Science

MS degree with 5–6 years experience

Job description

GlobalFoundries is seeking an experienced R&D engineer to join the Advanced Packaging Lab (APL) at Fab8 in Vermont. You will lead 3D-Heterogeneous Integration (3D-HI) initiatives including wafer-to-wafer and die-to-wafer bonding, TSV/TOV, and interposer development, driving end-to-end process integration across multiple programs.

The role requires a Master’s degree in engineering with 5–6 years of related experience, deep BEOL/TSV knowledge, and strong problem-solving and communication skills.