Senior 3D/2.5D Packaging Engineer — Integration Leader

GlobalFoundries; Essex Junction (VT); On-site; USD 118,000 - 210,000; Full time

Job summary

GlobalFoundries in Essex Junction, Vermont is seeking a Senior Engineer with expertise in chiplet-based system integration for advanced heterogeneous solutions. This role requires leading integration strategies for advanced packaging technologies such as 2.5D/3D. The ideal candidate should have a Master’s degree in a relevant field, at least 10 years of experience, and strong problem-solving and communication skills. The salary range is $118,000 to $210,000, based on qualifications and experience.

Qualifications

• 10+ years of related work experience required.
• In-depth knowledge of BEOL processes and advanced packaging integration.
• Demonstrated leadership and ability to influence across functions.

Responsibilities

• Lead advanced packaging technology platforms integration strategy.
• Collaborate on joint development projects for 2.5D/3D integration processes.
• Drive process integration and planning for new capabilities.

Skills

Problem-solving skills

Technical troubleshooting

Project management skills

Strong communication skills

Education

Master’s in Electrical Engineering or related field

PhD preferred

Job description

GlobalFoundries in Essex Junction, Vermont is seeking a Senior Engineer with expertise in chiplet-based system integration for advanced heterogeneous solutions. This role requires leading integration strategies for advanced packaging technologies such as 2.5D/3D. The ideal candidate should have a Master’s degree in a relevant field, at least 10 years of experience, and strong problem-solving and communication skills. The salary range is $118,000 to $210,000, based on qualifications and experience.