Senior 3D Heterogeneous Integration Engineer

GlobalFoundries inc.; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries seeks an experienced R&D engineer for the Advanced Packaging Lab to lead 3D-Heterogeneous Integration initiatives across multiple domains. You will drive BEOL process development, bonding, TSVs, and wafer-level packaging while partnering with engineers, vendors, and OSATs to enable new capabilities and rapid prototyping.

You will advance process integration, develop new materials and tooling expertise, perform data analysis, and troubleshoot integration challenges across

Qualifications

• MS degree with 4–5 years of related work experience.
• Deep knowledge of BEOL processes and integration (advanced bonding, TSVs).
• Experience with bump/wafer finish integration and wafer/probe tests.
• Collaboration with OSATs and experience in package development & assembly.
• Strong problem solving and DOE experience.

Responsibilities

• Lead 3D-HI process development for multi-die stacking and fine pitch bonding.
• Collaborate with unit process engineers, fabs, and vendors on tooling.
• Drive joint development projects for wafer-level 2.5D/3D integration.
• Plan end-to-end process integration and enable early prototyping.
• Develop expertise in processes, materials, and characterization resources.
• Analyze data, interpret results, and identify failure modes; resolve issues.

Skills

BEOL processes & integration

advanced bonding

TSVs

bump/wafer finish integration

wafer test/probe

OSAT collaboration

package development & assembly

design of experiments

troubleshooting

Education

Master’s degree in Electrical Engineering

Master’s degree in Mechanical Engineering

Master’s degree in Chemical Engineering

Master’s degree in Materials Science

Job description

GlobalFoundries seeks an experienced R&D engineer for the Advanced Packaging Lab to lead 3D-Heterogeneous Integration initiatives across multiple domains. You will drive BEOL process development, bonding, TSVs, and wafer-level packaging while partnering with engineers, vendors, and OSATs to enable new capabilities and rapid prototyping.

You will advance process integration, develop new materials and tooling expertise, perform data analysis, and troubleshoot integration challenges across