Quantum 3DHI Packaging Engineer

Global Foundries; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking a motivated R&D bonding integration engineer to join the Quantum Advanced Packaging team. This role focuses on 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding, in a fast-paced environment.

You will work with unit process engineers, OSAT partners, and cross-functional teams to advance 2.5D/3D integration, improve yields, and reduce cycle time while generating IP and maintaining safety standards.

Qualifications

• Bachelor's or Master's in Electrical, Mechanical, Chemical Engineering, Materials Science or related field.
• Prior internship or co-op experience.
• GPA at least 3.0 and good academic standing.
• Fluency in English (written & spoken).
• Travel up to 10%.

Responsibilities

• Drive 3DHI process development with unit process engineers and materials suppliers.
• Collaborate with OSATs to develop wafer/die level 2.5D and 3D Heterogeneous Integration processes.
• Develop expertise in processes, materials and tooling; leverage characterization resources.
• Drive understanding of failure modes and improve yields, reduce cycle time and costs.
• Generate IP related to wafer integration and packaging technology.

Skills

English fluency

Project management

Leadership experience

Written and verbal communication

Planning and organizational skills

Education

Bachelor's or Master's in Electrical/Mechanical/Chemical Engineering, Materials Science or related field

PhD education preferred

Job description

GlobalFoundries is seeking a motivated R&D bonding integration engineer to join the Quantum Advanced Packaging team. This role focuses on 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding, in a fast-paced environment.

You will work with unit process engineers, OSAT partners, and cross-functional teams to advance 2.5D/3D integration, improve yields, and reduce cycle time while generating IP and maintaining safety standards.