Senior Advanced Packaging Process Integration Engineer

GLOBALFOUNDRIES U.S. 2 LLC; Essex Junction (VT); On-site; USD 143,000 - 247,000; Full time

Job summary

GlobalFoundries is a leading semiconductor foundry seeking a senior packaging process integration engineer to lead post‑Fab process development focused on wafer finishing and assembly for advanced packaging and silicon photonics. The role involves cross‑functional collaboration with design, fabrication and packaging teams to meet customer requirements and drive new assembly flow development.

The candidate will drive CMP, thinning and dicing, with a strong emphasis on process integration, IP

Qualifications

• PhD in a relevant engineering field from an accredited program.
• Minimum 15 years of wafer finishing and assembly process experience.
• Willingness to travel up to 10%.

Responsibilities

• Lead packaging process development with unit process engineers and suppliers for advanced packaging.
• Drive CMP, wafer thinning, and dicing process development.
• Collaborate with engineers to develop new packaging processes for roadmaps.
• Lead next generation packaging and assembly development for various product needs.
• Partner with design, fabrication and packaging teams to set assembly specs and drive new flow.
• Drive understanding of failure modes with cross-functional teams to resolve issues.
• Adopt design for cost to enable continuous improvement projects.
• Generate IP related to wafer integration & packaging technology.
• Drive end-to-end process integration for capability planning and prototyping.
• Develop expertise in processes, materials and tooling for characterization resources.
• Collaborate with OSATs to develop new packaging integration processes.

Skills

English (Written & Verbal)

Education

PhD in Electrical Engineering (or related field)

Job description

GlobalFoundries is a leading semiconductor foundry seeking a senior packaging process integration engineer to lead post‑Fab process development focused on wafer finishing and assembly for advanced packaging and silicon photonics. The role involves cross‑functional collaboration with design, fabrication and packaging teams to meet customer requirements and drive new assembly flow development.

The candidate will drive CMP, thinning and dicing, with a strong emphasis on process integration, IP