Senior 3D/2.5D IC Integration Engineer

GlobalFoundries inc.

Essex Junction (VT)

On-site

USD 118,000 - 210,000

Full time

2 days ago

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Job summary

GlobalFoundries Advanced Packaging Lab seeks an accomplished engineer with extensive expertise in chiplet-based system integration, focusing on 2.5D interposer/bridge and 3D heterogeneous integration technologies. This senior role oversees end-to-end integration for advanced heterogeneous solutions across silicon, glass, and mold interposers and embedded silicon bridge architectures.

The position requires leadership across fab, design, reliability, and external partners, with travel up to 10%.

Qualifications

Master’s degree in a related engineering field required.
MS degree with at least 10 years of related work experience.
Strong knowledge of BEOL processes and advanced packaging integration.
Experience with design of experiments, statistical analysis, and yield/reliability learning.

Responsibilities

Lead 2.5D/3D packaging platforms integration strategy and readiness.
Collaborate with unit process, modeling, manufacturing engineers, and vendors.
Drive end-to-end process integration and planning for new capabilities and prototyping.
Own integration risk assessment and develop reliability strategy; lead root-cause analysis.
Promote technical innovation via patents and publications.
Support cross-functional teams across fab, design, reliability, and external partners.