Quantum 3DHI Engineer - Innovate in Packaging

GlobalFoundries; New York (NY); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries in New York is seeking a motivated New College Graduate for a role in R&D bonding integration within the Quantum Advanced Packaging team. The position centers on 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding, in a fast-paced environment.

Collaboration with unit process engineers, OSATs, and suppliers will drive development, yield improvements, and IP creation related to wafer integration and packaging technologies.

Qualifications

• Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
• Internship or co-op experience required.
• Overall GPA of 3.0 or higher.
• English language fluency (written and verbal).
• Travel up to 10%.

Responsibilities

• Drive 3DHI process development with unit process engineers and suppliers.
• Collaborate with OSATs to develop wafer and die level 2.5D/3D integration.
• Develop expertise in processes, materials, and tooling for characterization.
• Analyze failure modes and drive yield improvements and cost/cycle-time reduction.
• Generate IP related to wafer integration and packaging tech.
• Coordinate with other teams on assignments as needed.

Skills

3DHI process development

Wafer-to-wafer bonding

Die-to-wafer bonding

Project management

Leadership experience

Communication skills

English fluency

Education

Bachelor’s degree in EE/ME/ChE/Materials Science

Master’s degree in EE/ME/ChE/Materials Science

Job description

GlobalFoundries in New York is seeking a motivated New College Graduate for a role in R&D bonding integration within the Quantum Advanced Packaging team. The position centers on 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding, in a fast-paced environment.

Collaboration with unit process engineers, OSATs, and suppliers will drive development, yield improvements, and IP creation related to wafer integration and packaging technologies.