Senior 3D Packaging & TSV Integration Engineer

Global Foundries; Town of Malta (NY); On-site; USD 65,000 - 146,000; Full time

Job summary

GlobalFoundries in Malta, NY is seeking an Integration Engineer to drive next-generation packaging R&D. You will lead TSV process development, coordinate with unit process engineers, and collaborate with OSATs to advance wafer-level integration and qualification across multiple programs.

The role requires advanced degrees in electrical engineering and materials science, strong English communication, and willingness to travel up to 10%.

Qualifications

• PhD or Master’s in Electrical Engineering and Materials Science or related field; GPA ≥ 3.0.
• English language fluency (written & verbal)
• Travel up to 10%.

Responsibilities

• Lead TSV process development and planning with unit process engineers and tools at Malta Fab 8.
• Collaborate with OSATs to develop wafer-level integration processes.
• Develop expertise in ETCH, Litho, Plating, CMP, materials and tooling.
• Drive mechanism understanding of failure modes to improve yields and reduce cycle-time and costs.
• Generate IP related to wafer integration and packaging technology.
• Drive end-to-end process integration and planning across multiple programs.

Skills

Leadership experience

Project management

Communication skills

Team collaboration

Education

PhD in Electrical Engineering and Materials Science

Master's in Electrical Engineering and Materials Science

Tools

ETCH

Lithography (Litho)

Plating

CMP

Job description

GlobalFoundries in Malta, NY is seeking an Integration Engineer to drive next-generation packaging R&D. You will lead TSV process development, coordinate with unit process engineers, and collaborate with OSATs to advance wafer-level integration and qualification across multiple programs.

The role requires advanced degrees in electrical engineering and materials science, strong English communication, and willingness to travel up to 10%.