3DIC Bonding & Quantum Packaging Engineer

GlobalFoundries inc.; Essex Junction (VT); Presencial; USD 85.000 - 146.000; Jornada completa

Descripción de la vacante

GlobalFoundries is seeking a motivated R&D bonding integration engineer to join our Quantum Advanced Packaging team in Essex Junction, Vermont. The role covers 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding, and requires collaboration with process engineers, materials suppliers, and OSAT partners.

You will drive process development, understand failure modes, improve yields, and generate IP related to wafer integration and packaging technology.

Formación

• Bachelor’s or Master’s in a related engineering field.
• GPA 3.0 or higher.
• Internship or co-op experience in a relevant area.

Responsabilidades

• Drive 3DHI process development with unit process engineers and suppliers.
• Collaborate with OSATs to develop 2.5D/3D heterogeneous integration processes.
• Develop expertise in processes, materials and tooling for bonding.
• Drive understanding of failure modes and improve yields, cycle time and costs.
• Generate IP related to wafer integration and packaging technology.
• Work with teams on various assignments while maintaining safety and compliance.

Conocimientos

Project management

Communication skills

Leadership

Planning and organization

Educación

Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering or Materials Science

Herramientas

Wafer bonding equipment

Descripción del empleo

GlobalFoundries is seeking a motivated R&D bonding integration engineer to join our Quantum Advanced Packaging team in Essex Junction, Vermont. The role covers 3D heterogeneous integration development, including wafer-to-wafer and die-to-wafer bonding, and requires collaboration with process engineers, materials suppliers, and OSAT partners.

You will drive process development, understand failure modes, improve yields, and generate IP related to wafer integration and packaging technology.