Senior 3D/2.5D Packaging Engineer – Interposer & Bridge

GlobalFoundries; Essex (MD); On-site; USD 118,000 - 210,000; Full time

Job summary

A leading semiconductor foundry in the United States is seeking a Senior 3D Heterogeneous Integration Engineer to manage end-to-end integration for advanced packaging technologies. The successful candidate will have extensive experience in chiplet-based integration and will work closely with cross-functional teams. A Master's degree and a minimum of 10 years of related engineering experience is required, with a salary range of $118,000.00 - $210,000.00 depending on experience. This technical role promotes innovation in a fast-paced environment.

Qualifications

• MS degree with at least 10 years of prior related work experience.
• In-depth knowledge of BEOL processes and advanced packaging integration.
• Strong planning & organizational skills.

Responsibilities

• Lead integration strategy for 2.5D/3D advanced packaging technology platforms.
• Collaborate with cross-functional teams for development processes.
• Drive end-to-end process integration and planning.

Skills

Expertise in chiplet-based system integration

Strong problem-solving skills

Technical troubleshooting

Statistical analysis

Education

Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, Physics

Job description

A leading semiconductor foundry in the United States is seeking a Senior 3D Heterogeneous Integration Engineer to manage end-to-end integration for advanced packaging technologies. The successful candidate will have extensive experience in chiplet-based integration and will work closely with cross-functional teams. A Master's degree and a minimum of 10 years of related engineering experience is required, with a salary range of $118,000.00 - $210,000.00 depending on experience. This technical role promotes innovation in a fast-paced environment.