Senior Substrate & 3DIC Packaging Engineer
TSMC - Taiwan Semiconductor Manufacturing Company Limited
14 days+
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Benefits offered by this job
Job summary
A leading semiconductor company is seeking a Substrate / Advanced Package Engineer to join their innovative 3DIC design team in California. Candidates should have a Master's or Ph.D. with 15+ years of experience in advanced packaging technologies. The role involves design and simulation of complex substrate and packaging technologies, collaborating with cross-functional teams, and mentoring junior engineers. This position offers a competitive salary and benefits package.
Qualifications
- Master’s degree or Ph.D. in Electrical Engineering, Mechanical Engineering, or a related field.
- 15+ years of hands-on expertise in advanced packaging technologies and substrate design.
- Strong knowledge of warpage, stress, and thermal effects in packaging.
Responsibilities
- Design, simulate, and optimize advanced packaging for 3DIC applications.
- Collaborate with cross-functional teams to define specifications and requirements.
- Perform modeling of warpage, stress, reliability, and thermal performance using industry-standard EDA tools.
Skills
Expertise in advanced packaging technologies
Strong problem-solving skills
Exceptional collaboration skills
Knowledge of semiconductor device physics
Education
Master’s degree or Ph.D. in Electrical or Mechanical Engineering
Tools
EDA (Electronic Design Automation) tools
Job description
A leading semiconductor company is seeking a Substrate / Advanced Package Engineer to join their innovative 3DIC design team in California. Candidates should have a Master's or Ph.D. with 15+ years of experience in advanced packaging technologies. The role involves design and simulation of complex substrate and packaging technologies, collaborating with cross-functional teams, and mentoring junior engineers. This position offers a competitive salary and benefits package.
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