Interposer & 3D Packaging Design Engineer

SK hynix America

San Jose (CA)

On-site

USD 110,000 - 155,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Top Tier health insurance at no employee cost
Paid time off: PTO + Company Holidays + Happy Fridays
Paid Parental Leave Program
401k Matching
Educational reimbursement up to Ten Thousand Dollars per year
Donation Matching and volunteering opportunities
Corporate discount programs
Free Breakfast/Lunch/Dinner provided to employees

Job summary

A semiconductor company in San Jose, CA, is seeking an Advanced Package Design Engineer. This role involves designing high-performance interposers and collaborating with cross-functional teams to optimize packaging solutions. The ideal candidate should have a degree in Electrical Engineering, extensive experience in semiconductor layout, and proficiency with EDA tools. This position offers competitive compensation and top-tier benefits, ensuring a supportive workplace for innovation and growth.

Qualifications

  • 3+ years of experience in semiconductor package design or layout.
  • Proven experience with layout tools Virtuoso/APD, Synopsys Custom Compiler, Siemens Xpedition.
  • Familiar with 2.5D/3D packaging technologies.

Responsibilities

  • Design silicon and organic interposers for advanced packaging solutions.
  • Perform design studies and what-if scenario analysis for optimization.
  • Collaborate with internal and external stakeholders.

Skills

EDA tools such as Virtuoso/APD
High-speed signal routing
Effective communication skills

Education

Bachelor’s or Master’s degree in Electrical Engineering

Tools

Synopsys Custom Compiler
Siemens Xpedition

Job description

A semiconductor company in San Jose, CA, is seeking an Advanced Package Design Engineer. This role involves designing high-performance interposers and collaborating with cross-functional teams to optimize packaging solutions. The ideal candidate should have a degree in Electrical Engineering, extensive experience in semiconductor layout, and proficiency with EDA tools. This position offers competitive compensation and top-tier benefits, ensuring a supportive workplace for innovation and growth.
Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Advanced Packaging Engineer — 2.5D/3D Interposers
Advanced Packaging Engineer — 2.5D/3D Interposers

SK hynix America • San Jose (CA)

On-site
USD 110,000 - 155,000
Top Tier health insurance at no employee cost
Paid time off (PTO) + Company Holidays + Happy Fridays
Paid Parental Leave Program
+4
Semiconductor Package Design Engineer - 2.5D/3D Interposer
Semiconductor Package Design Engineer - 2.5D/3D Interposer

Micross Logo • Town of Florida (NY)

On-site
USD 140,000 - 190,000
Medical, HSA, and FSA plans
Dental and vision insurance
401k with employer match
+1
Senior Substrate & 3DIC Packaging Engineer
Senior Substrate & 3DIC Packaging Engineer

TSMC - Taiwan Semiconductor Manufacturing Company Limited • San Jose (CA)

On-site
USD 153,000 - 250,000
Comprehensive benefits package
Market competitive pay
Extensive development opportunities
Senior Packaging Engineer 3D/TSV, Equity
Senior Packaging Engineer 3D/TSV, Equity

ESR Healthcare • San Jose (CA)

On-site
USD 120,000 - 180,000
401K
Bonus
Stock/Equity
+1
Senior 3D/2.5D Packaging Engineer – Interposer & Bridge
Senior 3D/2.5D Packaging Engineer – Interposer & Bridge

GlobalFoundries • Essex (MD)

On-site
USD 118,000 - 210,000
Principal Engineer, Advanced Packaging Innovation
Principal Engineer, Advanced Packaging Innovation

Micron Technology, Inc • Boise (ID)

On-site
USD 100,000 - 150,000
Medical, dental, and vision plans
Paid time-off and holidays
Income protection programs
Senior Substrate & 3DIC Packaging Engineer
Senior Substrate & 3DIC Packaging Engineer

TSMC - Taiwan Semiconductor Manufacturing Company Limited • California (MO)

On-site
USD 153,000 - 250,000
Comprehensive benefits
Extensive development opportunities
Market competitive pay
Staff Packaging Engineer: 2.5D/3D Hybrid
Staff Packaging Engineer: 2.5D/3D Hybrid

Adeia • San Jose (CA)

On-site
USD 150,000 - 195,000
Medical benefits
401(k)
Flexible time off
+1
IC Package Engineer - 2.5D/3D Packaging & SI/PI
IC Package Engineer - 2.5D/3D Packaging & SI/PI

Gsme • San Jose (CA), Northern (KY)

Hybrid
USD 110,000 - 170,000
Director of Advanced Packaging & Heterogeneous Integration
Director of Advanced Packaging & Heterogeneous Integration

Applied Materials • Santa Clara (CA)

On-site
USD 180,000 - 248,000
Comprehensive benefits package
Supportive work culture
Relocation assistance