Semiconductor Package Design Engineer - 2.5D/3D Interposer

Micross Logo; Town of Florida (NY); On-site; USD 140,000 - 190,000; Full time

Benefits offered by this job

Medical, HSA, and FSA plans

Dental and vision insurance

401k with employer match

Generous tuition assistance

Job summary

A leading semiconductor solutions company in New York is seeking a packaging design engineer. The role requires 8-10 years of experience in semiconductor packaging design, strong expertise in Cadence APD+, and collaboration with design teams. A competitive benefits package, including health insurance and tuition assistance, is offered. This position demands excellent problem-solving skills and the ability to work effectively in a cross-functional team environment.

Qualifications

• 8 to 10 years of experience in semiconductor packaging design, modeling, and simulations.
• Strong authority on Cadence Allegro Package Designer Plus (APD+).
• Experience with design teams on floor plan, bump, and layout optimization.

Responsibilities

• Design advanced semiconductor packages including layout and optimization.
• Collaborate with IC design teams to define package requirements.
• Conduct PI/SI analysis and documentation.

Skills

Cadence Allegro Package Designer Plus (APD+)

Signal Integrity (SI) analysis

Power Integrity (PI) analysis

RF/Microwave Design

Problem solving

Team collaboration

Education

Bachelor's degree in Electrical Engineering

Tools

Sigrity Advanced SI II

AWR

HFSS

Job description

A leading semiconductor solutions company in New York is seeking a packaging design engineer. The role requires 8-10 years of experience in semiconductor packaging design, strong expertise in Cadence APD+, and collaboration with design teams. A competitive benefits package, including health insurance and tuition assistance, is offered. This position demands excellent problem-solving skills and the ability to work effectively in a cross-functional team environment.