Advanced 3D Heterogeneous Integration Engineer

GlobalFoundries; Town of Malta (NY); On-site; USD 98,000 - 176,000; Full time

Job summary

A leading semiconductor foundry is seeking a 3D Heterogeneous Integration Engineer to join the Advanced Packaging Lab. The successful candidate will drive process development for packaging solutions, collaborate on joint projects, and provide mentorship to new hires. Required qualifications include a Master's degree in a related field and at least 5 years of experience. Knowledge of BEOL processes is essential. This role offers a salary range of $98,000 to $176,000, commensurate with experience and qualifications.

Qualifications

• Master’s degree in relevant field with at least 5 years of related experience.
• In-depth knowledge of BEOL processes, integration, and package development.
• Experience in design of experiments and problem-solving.

Responsibilities

• Drive 3D-HI process development for advanced packaging solutions.
• Collaborate with engineers and vendors for development projects.
• Mentor and guide new hires.

Skills

Problem solving

Technical troubleshooting

Data analysis

Strong communication skills

Project management

Education

Master’s in Electrical Engineering

Job description

A leading semiconductor foundry is seeking a 3D Heterogeneous Integration Engineer to join the Advanced Packaging Lab. The successful candidate will drive process development for packaging solutions, collaborate on joint projects, and provide mentorship to new hires. Required qualifications include a Master's degree in a related field and at least 5 years of experience. Knowledge of BEOL processes is essential. This role offers a salary range of $98,000 to $176,000, commensurate with experience and qualifications.