Semiconductor Research Engineer: Metrology & Packaging

Intel Corporation

Phoenix (AZ)

On-site

USD 142,000 - 200,000

Full time

5 days ago

Be an early applicant

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation is seeking a Semiconductor Research Engineer in the US (Phoenix) to advance assembly and packaging technologies. You will design, prototype, and test innovative devices and interconnects, applying device physics, optics, and thermomechanics to optimize performance, reliability, and cost.

You will collaborate with the Assembly Materials Characterization Lab to develop metrology solutions for advanced packaging such as CPO, EMIB, and Foveros, driving Intel's leadership in

Qualifications

Master's degree with 4+ years of experience or PhD with 2+ years.
Proven research in optical metrology or packaging design.
Experience with lab testing, data analysis, and DOE methods.

Responsibilities

Conduct research using device physics, optics, and thermomechanical analysis.
Design and fabricate metrology prototypes for packaging tech.
Develop testing methodologies for characterization and reliability.
Plan cross-functional experiments to benchmark results.
Model trade-offs between design, performance, and reliability.

Skills

Python

MATLAB

Device physics

Dimensional metrology

Packaging design

Statistical analysis

Education

Master's in Electrical Engineering, Physics, Materials Science, or Mechanical Engineering

PhD in a related field

Tools

DOE

CPO

EMIB

Foveros

Job description

You will collaborate with the Assembly Materials Characterization Lab to develop metrology solutions for advanced packaging such as CPO, EMIB, and Foveros, driving Intel's leadership in

Get your free, confidential resume review.

or drag and drop your file here.