Senior Metrology Engineer - Packaging Pathfinding

Intel Corporation; Hillsboro (OR); On-site; USD 115,000 - 220,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health, retirement, and vacation benef

Job summary

Intel Corporation's Advanced Packaging Technology Development Metrology Group in Hillsboro, Oregon seeks a Senior Module Development Engineer to lead next-generation metrology equipment development and end-to-end qualification from installation to fab readiness.

You will work across cross-functional teams, define roadmaps, collaborate with AI and advanced process control groups, and translate industry trends into concrete capabilities that keep Intel ahead of program demand.

Qualifications

• Bachelor's degree with 4+ years of relevant experience, or advanced degree with required years.
• Experience in semiconductor processing, wafer-level assembly, or cleanroom environments.
• Proficiency in process development methodologies and SPC.
• Technical expertise in module engineering or fab process/hardware development.
• Strong collaboration and data-analysis abilities for optimization.

Responsibilities

• Lead metrology technology development across high-volume and future nodes.
• Design and develop metrology/inspection processes and system configurations.
• Define long-range metrology roadmaps aligned with industry trends.
• Conduct feasibility studies and early assessments of new measurement approaches.
• Qualify end-to-end metrology equipment from install to fab readiness.
• Serve as primary technical resource for fab support and tool performance.
• Partner with suppliers to co-develop enabling tool capabilities.
• Collaborate with AI/APC teams to create predictive process controls.
• Present readiness and risk status to senior leadership.

Skills

Semiconductor processing

Wafer-level assembly

Statistical process control

Process development

Data analysis

Packaging processes

Equipment automation

Project management

Python scripting

Education

Bachelor's degree in STEM fields

Master's degree or PhD in related fields

Tools

Scripting tools (Python)

Metrology equipment collaboration

Job description

Intel Corporation's Advanced Packaging Technology Development Metrology Group in Hillsboro, Oregon seeks a Senior Module Development Engineer to lead next-generation metrology equipment development and end-to-end qualification from installation to fab readiness.

You will work across cross-functional teams, define roadmaps, collaborate with AI and advanced process control groups, and translate industry trends into concrete capabilities that keep Intel ahead of program demand.