Senior Metrology Engineer - Packaging Pathfinding

Intel Corporation

Hillsboro (OR)

On-site

USD 115,000 - 220,000

Full time

2 days ago

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Benefits offered by this job

Competitive pay

Stock bonuses

Health, retirement, and vacation benef

Job summary

Intel Corporation's Advanced Packaging Technology Development Metrology Group in Hillsboro, Oregon seeks a Senior Module Development Engineer to lead next-generation metrology equipment development and end-to-end qualification from installation to fab readiness.

You will work across cross-functional teams, define roadmaps, collaborate with AI and advanced process control groups, and translate industry trends into concrete capabilities that keep Intel ahead of program demand.

Qualifications

Bachelor's degree with 4+ years of relevant experience, or advanced degree with required years.
Experience in semiconductor processing, wafer-level assembly, or cleanroom environments.
Proficiency in process development methodologies and SPC.
Technical expertise in module engineering or fab process/hardware development.
Strong collaboration and data-analysis abilities for optimization.

Responsibilities

Lead metrology technology development across high-volume and future nodes.
Design and develop metrology/inspection processes and system configurations.
Define long-range metrology roadmaps aligned with industry trends.
Conduct feasibility studies and early assessments of new measurement approaches.
Qualify end-to-end metrology equipment from install to fab readiness.
Serve as primary technical resource for fab support and tool performance.
Partner with suppliers to co-develop enabling tool capabilities.
Collaborate with AI/APC teams to create predictive process controls.
Present readiness and risk status to senior leadership.