Semiconductor Research Engineer

100 Intel Corporation; Chandler (AZ); On-site; USD 142,000 - 200,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health

Retirement

Vacation

Job summary

Intel Corporation in the United States seeks a Semiconductor Research Engineer to advance assembly and packaging technologies, designing and testing devices, interconnects, and metrology solutions.

You will prototype and research to optimize performance, reliability, and cost, collaborating with cross-functional teams in a dynamic environment that values innovation and leadership.

Qualifications

• Master’s degree with 4+ years of experience or PhD with 2+ years of experience in a relevant field.
• Experience in research including optical test metrology, dimensional metrology, and packaging design methodologies.
• Programming skills in Python or MATLAB for engineering applications.

Responsibilities

• Conduct research using device physics, optics, electromagnetics, and thermomechanical analysis to enable novel devices and packaging technologies.
• Design and fabricate metrology prototypes to validate groundbreaking concepts for semiconductor assembly and interconnect solutions.
• Develop testing methodologies for component and device characterization, including dimension, optical signal loss, and stressing.
• Plan and execute experiments with cross-functional teams to benchmark results against industry standards.
• Model and analyze trade-offs between design, performance, and reliability to ensure optimal solutions.
• Collaborate with external vendors and researchers to support Intel's research pipeline.

Skills

Analytical thinking

Problem solving

Education

Master’s in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or related field

PhD with 2+ years of experience

Tools

Python

MATLAB

Job description

As a Semiconductor Research Engineer, you will play a crucial role in advancing Intel's assembly and packaging technologies. You will design, develop, and test innovative devices, interconnects, and packaging solutions, leveraging device physics, electromagnetics, and materials science. Your hands-on work will include prototyping and research to optimize performance, reliability, and cost, directly impacting Intel's technological leadership in semiconductor innovation.

Business Group Intel Corporation’s Assembly Materials Characterization Lab, in Core Competency of Advanced Design and Customer Enabling is dedicated to enabling next-generation semiconductor technologies. This group combines cutting-edge research and development to deliver next generation metrology solution for advanced packaging solutions that drive miniaturization, performance enhancements, and functionality.

As part of this dynamic team, you will contribute to Intel's mission to enhance technological capabilities and maintain industry leadership.

Key Responsibilities

• Conduct research using device physics, optics, electromagnetics, and thermomechanical analysis to enable novel devices and packaging technologies.
• Design and fabricate metrology prototypes to validate groundbreaking concepts for semiconductor assembly and interconnect solutions.
• Develop testing methodologies for component and device characterization, including dimension, optical signal loss, and stressing.
• Plan and execute experiments with cross-functional teams to benchmark results against industry standards.
• Model and analyze trade‑offs between design, performance, and reliability to ensure optimal solutions.
• Collaborate with external vendors and researchers to support Intel's research pipeline.

Behavioral traits

• Lead and influence technical teams to achieve milestones.
• Analytical and problem‑solving abilities to address unique engineering challenges.
• Excellent organizational and communication skills, with experience presenting findings and mentoring team members.

Qualifications

Minimum Qualifications

• Master’s in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field with 4+ years of experience.
• OR PhD degree with 2+ years of experience.
• Experience in research, including optical test metrology, dimensional metrology, and packaging design methodologies.
• Programming skills in Python or MATLAB for engineering applications.
• Experimental setups and data analysis techniques for lab testing.

Preferred Qualifications

• Experience with advanced Co-Packaged Optics (CPO).
• Experience with advanced packaging technologies like EMIB and Foveros architectures.
• Expertise in Design of Experiments (DOE), statistical analysis methods, and model‑based problem‑solving techniques.
• Familiarity with materials characterization techniques and cross-disciplinary collaboration.

Join a team that thrives on innovation, collaboration, and excellence. Be part of shaping the future of semiconductor technology with Intel.

Job Type: Experienced Hire

Shift: Shift 1 (United States of America)

Primary Location: US, Arizona, Phoenix

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust: N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

• Competitive pay
• Stock bonuses
• Health
• Retirement
• Vacation

Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Work Model for this Role

This role will require an on‑site presence.

• Job posting details (such as work model, location or time type) are subject to change.
• ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices.
• We do not charge any fees during our hiring process.
• Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during the hiring process, please report this immediately to your recruiter.