Packaging Module Equipment Engineer - Advanced IC Packaging

Intel Corporation; Phoenix (AZ); Presencial; USD 134.000 - 189.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Stock bonuses

Health benefits

Vacation

Descripción de la vacante

Intel Corporation in Chandler, Arizona is seeking a Senior Packaging Module Development Engineer to advance semiconductor packaging processes and equipment for the next-generation roadmap. The role requires hands-on collaboration in state-of-the-art labs, on-site, to develop advanced assembly processes and drive reliability testing simulations.

You will lead cross-functional efforts in process qualification, equipment integration, DOE/SPC studies, and data-driven problem solving, coordinating

Formación

• Bachelor's degree in Mechanical, Electrical, Materials or Chemical Engineering with 4+ years semiconductor experience.
• Or a Master’s degree in a matching STEM discipline with 3+ years of semiconductor experience.
• Or a PhD in a matching STEM discipline with 6+ months of semiconductor experience.
• Experience applying SPC/DOE in high-tech manufacturing environments.
• Experience managing change control, equipment sustaining, or quality data systems.

Responsabilidades

• Process qualification: develop and qualify advanced packaging assembly processes, materials, and hardware.
• Equipment integration: manage first-time process integration and tooling selection.
• Reliability testing: develop simulations and testing under thermal/humidity/ cycling conditions.
• SPC/DOE: design experiments and analyze data to optimize productivity.
• Global standardization: drive standardization across Intel manufacturing sites.
• Technical documentation: produce reports, logs, and transfer-ready documents.

Conocimientos

SPC/DOE methods

Change control

Structured problem solving

Data-driven validation

Cross-functional leadership

Educación

Bachelor's in Mechanical/Electrical/Materials/Chemical Eng

Master's in STEM

PhD in STEM

Herramientas

Dispense equipment

Mold & cure equipment

Descripción del empleo

Intel Corporation in Chandler, Arizona is seeking a Senior Packaging Module Development Engineer to advance semiconductor packaging processes and equipment for the next-generation roadmap. The role requires hands-on collaboration in state-of-the-art labs, on-site, to develop advanced assembly processes and drive reliability testing simulations.

You will lead cross-functional efforts in process qualification, equipment integration, DOE/SPC studies, and data-driven problem solving, coordinating