Thermal & Packaging Engineer, Semiconductors

Intel Corporation; Chandler (AZ); On-site; USD 164,000 - 232,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation is seeking a Semiconductor Research Engineer in Arizona to drive experimental device physics, packaging concepts, and materials science innovations. You will design, simulate, and fabricate prototypes, then test them across DC and RF domains to validate performance and reliability.

You will collaborate with cross‑functional teams, develop DOE methodologies, and mentor others while advancing assembly and packaging platform technologies for next‑gen devices at Intel.

Qualifications

• Bachelor's degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field
• 6+ years with a bachelor's degree, 4+ years with a master's, or 2+ years with a PhD
• Advanced experience in semiconductor fabrication processes (lithography, etch, diffusion, packaging design)
• Advanced experience in simulation tools (ANSYS, Abaqus) for FEA and CFD
• Advanced programming in Python or MATLAB for engineering applications
• Hands-on experience with experimental setups and data analysis techniques

Responsibilities

• Conduct research leveraging device physics, thermomechanical analysis, materials science, and process innovations to enable novel devices and systems
• Design and fabricate prototypes to demonstrate proof-of-concepts for groundbreaking packaging and interconnect technologies
• Perform electrical testing and establish methodologies for device characterization (DC, RF, pulsing, stressing)
• Develop process solutions across production modules (lithography, etch, diffusion, CVD, PVD, CMP)
• Plan and execute experiments with device, reliability, and fabrication teams to benchmark against industry standards
• Develop models and measurements to advance understanding of device physics, packaging, and systems for future platforms
• Engage with external vendors and researchers to support collaborations and Intel's research pipeline

Skills

Python

MATLAB

DOE

Data analysis

Education

Bachelor's degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or related field

Master's degree in related field

PhD in related field

Tools

ANSYS

Abaqus

Job description

Intel Corporation is seeking a Semiconductor Research Engineer in Arizona to drive experimental device physics, packaging concepts, and materials science innovations. You will design, simulate, and fabricate prototypes, then test them across DC and RF domains to validate performance and reliability.

You will collaborate with cross‑functional teams, develop DOE methodologies, and mentor others while advancing assembly and packaging platform technologies for next‑gen devices at Intel.