Advanced Packaging Process Engineer – Semiconductors

Intel Corporation; Chandler (AZ); Presencial; USD 99 000 - 189 000; Tempo integral

Resumo da oferta

Intel Corporation in Arizona seeks a Packaging Process Development Engineer to advance next-generation semiconductor packaging technologies. You will develop and optimize assembly media and collateral processes, applying DOE and SPC to deliver reliable, cost-effective solutions.

Qualifications include a Bachelors or Masters in a relevant STEM field with 2+ years of experience, and proficiency with SolidWorks/AutoCAD and GD&T.

Qualificações

• Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field with 2+ years of experience; or master's degree.
• Knowledge of mechanical design software such as SolidWorks or AutoCAD; Mechanical drawings; GD&T principles.
• Preferred qualifications include SPC/DOE methods, project management, high-precision manufacturing, semiconductor packaging, supply chain experience.

Responsabilidades

• Develop and optimize assembly media and collaterals to meet quality, reliability, cost, yield, productivity targets.
• Apply DOE and SPC principles to refine media and collateral capabilities and document results.
• Design and maintain equipment to evaluate media and collateral performance under simulated field conditions.
• Ensure manufacturability of physical prototypes and oversee full lifecycle of workflows.
• Define material specifications and work with supplier quality and procurement to ensure compliance.
• Leverage understanding of failure mechanisms to set reliability benchmarks.
• Lead problem-solving and continuous improvement for media and collaterals.
• Standardize qualification practices and manage risks in line with milestones and delivery schedules.
• Serve as SME, providing technical consultation to internal teams and external partners.

Conhecimentos

Collaborative mindset

Analytical thinking

Effective communication

Adaptability

Attention to detail

Initiative & ownership

Resilience

Formação académica

Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or related STEM field

Master's degree in mechanical engineering, Materials Science, Metallurgical Engineering, or related STEM field

Ferramentas

SolidWorks

AutoCAD

Descrição da oferta de emprego

Intel Corporation in Arizona seeks a Packaging Process Development Engineer to advance next-generation semiconductor packaging technologies. You will develop and optimize assembly media and collateral processes, applying DOE and SPC to deliver reliable, cost-effective solutions.

Qualifications include a Bachelors or Masters in a relevant STEM field with 2+ years of experience, and proficiency with SolidWorks/AutoCAD and GD&T.