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Cisco Systems is seeking a highly skilled Signal and Power Integrity Technical Leader to drive next‑generation ASIC packaging and lead the Silicon Packaging SI/PI team. You will define design rules for ultra‑high‑speed signaling across interposer, substrate, and PCB.
You’ll collaborate with system partners, vendors, and design leads to meet power, performance, and area goals, mentor engineers, and shape a culture of design reviews and continuous improvement on multi‑discipline teams.
Cisco Systems is seeking a highly skilled Signal and Power Integrity Technical Leader to drive next‑generation ASIC packaging and lead the Silicon Packaging SI/PI team. You will define design rules for ultra‑high‑speed signaling across interposer, substrate, and PCB.
You’ll collaborate with system partners, vendors, and design leads to meet power, performance, and area goals, mentor engineers, and shape a culture of design reviews and continuous improvement on multi‑discipline teams.