Remote Signal & Power Integrity Tech Lead, ASICs

Cisco Systems

Appleton (WI)

Remote

USD 214,000 - 310,000

Full time

14 days+

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Job summary

Cisco Systems is seeking a highly skilled Signal and Power Integrity Technical Leader to drive next‑generation ASIC packaging and lead the Silicon Packaging SI/PI team. You will define design rules for ultra‑high‑speed signaling across interposer, substrate, and PCB.

You’ll collaborate with system partners, vendors, and design leads to meet power, performance, and area goals, mentor engineers, and shape a culture of design reviews and continuous improvement on multi‑discipline teams.

Qualifications

  • Bachelor’s or higher in Electrical Engineering with 10+ years SI/PI experience.
  • Experience with multiple high-speed ASIC tape-outs from a package perspective.
  • Proficient in high-speed SerDes and 56G PAM4.

Responsibilities

  • Lead packaging SI/PI team to define, design and verify ASIC packaging.
  • Develop design rules for ultra-high-speed signaling, meeting power, performance and area goals.
  • Analyze substrate SI and PI and collaborate with layout for optimal solutions.
  • Design ASIC packages for high-volume, high-quality releases with post-layout extraction.
  • Mentor engineers and drive design reviews and continuous improvement across teams.

Skills

Signal integrity
Power integrity
Team leadership
Package design
Design verification

Education

Bachelor's Electrical Engineering
Master's Electrical Engineering
PhD Electrical Engineering

Tools

Keysight ADS
Ansys HFSS/EM flow
Cadence APD
SPICE

Job description

Cisco Systems is seeking a highly skilled Signal and Power Integrity Technical Leader to drive next‑generation ASIC packaging and lead the Silicon Packaging SI/PI team. You will define design rules for ultra‑high‑speed signaling across interposer, substrate, and PCB.

You’ll collaborate with system partners, vendors, and design leads to meet power, performance, and area goals, mentor engineers, and shape a culture of design reviews and continuous improvement on multi‑discipline teams.

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