Remote Senior Signal & Power Integrity Leader

Cisco Systems; Herndon (VA); Remote; USD 214,000 - 310,000; Full time

Job summary

Cisco Systems is seeking a Signal and Power Integrity Technical Leader to drive next-generation ASIC packaging, leading a specialized team to define, design, and verify packaging across Cisco platforms.

The role emphasizes ultra-high-speed signaling, SI/PI analysis, and collaboration with layout, vendors, and design leads to ensure robust, scalable solutions for data centers and networking equipment.

Qualifications

• Bachelors with extensive experience in signal and/or power integrity; advanced degrees offer additional context.
• Experience with multiple high-speed ASIC tape-outs from a package perspective.
• Hands-on lab experience with high-frequency toolchains and simulation environments.

Responsibilities

• Lead the Silicon Packaging SI/PI team to define, design and verify ASIC packaging.
• Develop design rules for ultra-high-speed signaling to meet power/performance/area goals.
• Analyze substrate SI/PI and collaborate with layout for optimal interposer, substrate, and PCB solutions.
• Lead packaging development from post-layout extraction to high-volume release.
• Mentor engineers and promote design-review culture across teams.

Skills

High-speed ASIC tape-outs

PAM4 signaling

SerDes architectures

Channel modeling

Power integrity

Electromagnetics

Education

Bachelor's degree in Electrical Engineering

Master's degree in Electrical Engineering

PhD in Electrical Engineering

Tools

Keysight ADS

Ansys HFSS/EM flow

Cadence APD

SPICE

Job description

Cisco Systems is seeking a Signal and Power Integrity Technical Leader to drive next-generation ASIC packaging, leading a specialized team to define, design, and verify packaging across Cisco platforms.

The role emphasizes ultra-high-speed signaling, SI/PI analysis, and collaboration with layout, vendors, and design leads to ensure robust, scalable solutions for data centers and networking equipment.