Quantum Interposer Packaging Engineer

Intel Corporation; Hillsboro, Northern (OR, KY); Hybrid; USD 142,000 - 200,000; Full time

Job summary

Intel Corporation in Oregon’s Quantum Computing Group seeks a Quantum Interposer Design Engineer to lead physical design and integration of interposers for quantum packaging. You will collaborate with multidisciplinary teams, validate designs with DRC/LVS, and communicate milestones to stakeholders.

The role requires strong problem solving, excellent communication, and adaptability in a fast-paced research environment focused on silicon quantum dot technology and scalable quantum systems.

Qualifications

• MS in Electrical Engineering with 5+ years in silicon testchips, interposers and related hardware.
• PhD in Electrical Engineering accepted with related experience.
• Cadence Virtuoso and SI/PI impacts on physical design experience.
• Knowledge of advanced packaging technologies is required or preferred.

Responsibilities

• Physical design and integration of interposers for quantum packaging.
• Collaborate with silicon testchip, SI/PI, thermal and system engineers to meet design requirements.
• Perform design validation including DRC and LVS checks.
• Deliver milestones to stakeholders and document designs clearly.
• Stay current with packaging technology by reading papers and attending conferences.

Skills

SI/PI knowledge

Packaging design

Problem solving

Collaboration

Education

M.S./Ph.D. in Electrical Engineering

Tools

Cadence Virtuoso

Synopsys

Ansys

Job description

Intel Corporation in Oregon’s Quantum Computing Group seeks a Quantum Interposer Design Engineer to lead physical design and integration of interposers for quantum packaging. You will collaborate with multidisciplinary teams, validate designs with DRC/LVS, and communicate milestones to stakeholders.

The role requires strong problem solving, excellent communication, and adaptability in a fast-paced research environment focused on silicon quantum dot technology and scalable quantum systems.