Quantum Packaging Thermal Engineer

Intel Corporation; Hillsboro, Northern (OR, KY); Hybrid; USD 142,000 - 200,000; Full time

Job summary

Intel Corporation's Quantum Packaging Modeling Engineer role in Oregon focuses on thermal modeling and simulation of packaging hardware, from silicon test chips to heat spreaders, enabling cross-disciplinary co-design. You will partner with mechanical designers and stakeholders to deliver robust, efficient thermal solutions and report milestones with clear documentation.

The position requires strong communication, analytical thinking, and adaptability to a fast-paced quantum research

Qualifications

• MS/PhD in a related field with 5+ years of thermal modeling experience in packaging.
• Experience with thermal/mechanical modeling, simulation, and optimization using Ansys Icepak and COMSOL.
• Understanding of packaging technologies and thermal integration.
• Excellent communication and presentation skills; ability to work across teams.

Responsibilities

• Thermal modeling and simulation of packaging hardware to understand heat flow from silicon test chips through heat spreader hardware.
• Manage the overall integration of the packaging hardware and enable co-design between stakeholders.
• Work with mechanical designers to define heat spreaders for optimal performance.
• Deliver design milestones to stakeholders and present designs in documentation.
• Stay current with packaging technology developments by reading papers and attending conferences.

Skills

Communication skills

Analytical thinking

Collaboration

Adaptability

Presentation skills

Education

MS in Electrical Engineering, Physics or related field

PhD in Electrical Engineering, Physics or related field

Tools

Ansys Icepak

COMSOL

Job description

Intel Corporation's Quantum Packaging Modeling Engineer role in Oregon focuses on thermal modeling and simulation of packaging hardware, from silicon test chips to heat spreaders, enabling cross-disciplinary co-design. You will partner with mechanical designers and stakeholders to deliver robust, efficient thermal solutions and report milestones with clear documentation.

The position requires strong communication, analytical thinking, and adaptability to a fast-paced quantum research