Quantum IC Substrate Design Engineer - 2.5D/3D Packaging

Intel Corporation; Hillsboro (OR); On-site; USD 122,000 - 173,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Oregon is seeking a Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team. The role focuses on designing large form factor IC substrates within a multidisciplinary team, advancing silicon quantum dot technology and scalable quantum systems.

You will work with Siemens Xpedition, engage with SI/PI/thermal analyses, and coordinate tapeouts with substrate suppliers, contributing to state-of-the-art packaging solutions and on-site

Qualifications

• B.S. or M.S. in Electrical/Computer Engineering with required experience.
• Experience with Siemens Xpedition and high-speed routing.
• Experience with large form factor IC substrates.

Responsibilities

• Design of IC substrates using Siemens Xpedition IC package design software.
• Collaborate with stakeholders to meet design requirements, e.g., receive feedback from silicon testchip, SI, PI, thermal, and system engineers.
• Deliver and disseminate design milestones to stakeholders.
• Design validation and verification; including DRC and LVS.
• Advanced packaging design integration (2.5D and 3D) with IC substrate.
• Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams.
• Communicate designs in presentations and relevant documentation.
• Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers.

Skills

Siemens Xpedition

High-speed routing

IC substrate design

2.5D/3D packaging

Tapeout coordination

SI/PI/thermal analysis

Communication/presentation

Education

Bachelor’s/Master’s in Electrical/Computer Engineering

Tools

Siemens Xpedition

Signal integrity tools

Job description

Intel Corporation in Oregon is seeking a Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team. The role focuses on designing large form factor IC substrates within a multidisciplinary team, advancing silicon quantum dot technology and scalable quantum systems.

You will work with Siemens Xpedition, engage with SI/PI/thermal analyses, and coordinate tapeouts with substrate suppliers, contributing to state-of-the-art packaging solutions and on-site