Quantum IC Substrate & 3D Packaging Design Engineer

Intel Corporation; Hillsboro, Northern (OR, KY); Híbrido; USD 122 000 - 173 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

Health insurance

Retirement plan

Vacation

Resumo da oferta

Intel Corporation in Oregon is seeking a Quantum IC Substrate Package Layout Design Engineer to design large form factor IC substrates within a multidisciplinary team. You will deliver and validate IC substrate designs, collaborate across SI/PI/thermal teams, and coordinate tapeouts with substrate suppliers.

The role emphasizes fast-paced, innovative research in silicon quantum dot packaging. The position requires strong communication skills and a proven ability to work across diverse teams,

Qualificações

• Bachelor's or master's degree in electrical/computer engineering or related field.
• 5+ years of IC substrate design experience for CPU/GPU/SoC/ASIC.
• Experience with Siemens Xpedition design environment and workflow.
• Strong knowledge of high-speed signal routing and large form factor substrates.

Responsabilidades

• Design of IC substrates using Siemens Xpedition IC package design software.
• Collaborate with stakeholders to meet design requirements (SI, PI, thermal).
• Deliver design milestones and perform design validation (DRC/LVS).
• Integrate advanced packaging (2.5D/3D) with IC substrate; tapeout with suppliers.
• Present designs and documentation; stay updated on packaging tech.

Conhecimentos

Strong analytical thinking

Excellent communication

Collaborative mindset

Formação académica

Bachelor's degree in Electrical Engineering or Computer Engineering

Master's degree in Electrical Engineering or Computer Engineering

Ferramentas

Siemens Xpedition

Descrição da oferta de emprego

Intel Corporation in Oregon is seeking a Quantum IC Substrate Package Layout Design Engineer to design large form factor IC substrates within a multidisciplinary team. You will deliver and validate IC substrate designs, collaborate across SI/PI/thermal teams, and coordinate tapeouts with substrate suppliers.

The role emphasizes fast-paced, innovative research in silicon quantum dot packaging. The position requires strong communication skills and a proven ability to work across diverse teams,