Quantum Interposer Design Engineer: Silicon Qubit Packaging

Intel; Hillsboro (OR); On-site; USD 142,000 - 200,000; Full time

Benefits offered by this job

Health benefits

Stock bonuses

Retirement plan

Vacation policy

Job summary

Intel's Quantum Computing Group in Oregon seeks a Quantum Interposer Design Engineer to drive physical design and integration of interposers for silicon quantum dot packaging. You will collaborate with cross‑functional teams, validate designs, and communicate milestones while staying abreast of packaging advances.

The role emphasizes strong communication, analytical thinking, and adaptability in a fast-paced research environment, with on‑site work in Hillsboro, OR.

Qualifications

• MS or PhD in Electrical Engineering with related hardware design experience.
• Experience in physical design of silicon testchips and interposers.
• Understanding of SI/PI impacts on physical design.

Responsibilities

• Physically design and integrate interposers for advanced packaging.
• Collaborate with silicon testchip, SI/PI, thermal, and system teams.
• Perform DRC/LVS, design validation and milestone communication.

Skills

Excellent communication

Presentation skills

Analytical thinking

Collaborative mindset

Adaptability

Passion for quantum tech

Education

M.S. in Electrical Engineering

Ph.D. in Electrical Engineering

Tools

Cadence Virtuoso

Synopsys

Ansys

Job description

Intel's Quantum Computing Group in Oregon seeks a Quantum Interposer Design Engineer to drive physical design and integration of interposers for silicon quantum dot packaging. You will collaborate with cross‑functional teams, validate designs, and communicate milestones while staying abreast of packaging advances.

The role emphasizes strong communication, analytical thinking, and adaptability in a fast-paced research environment, with on‑site work in Hillsboro, OR.