Quantum Packaging SI/PI Engineer - Shape Quantum Hardware

Intel Corporation; Hillsboro (OR); On-site; USD 142,000 - 200,000; Full time

Job summary

Intel Corporation in Oregon is seeking an experienced Quantum Packaging SI/PI Engineer to model and simulate packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team.

The role emphasizes SI/PI modeling, validation, and optimization using tools like SIwave, HFSS, and ADS. Collaboration with hardware teams and stakeholders is essential to meet ambitious quantum packaging goals in a fast-paced research environment.

Qualifications

• M.S. degree in Electrical Engineering, Physics or related field AND 3+ years of experience in SI/PI for packaging, silicon testchip, or other related hardware. OR Ph.D. degree in Electrical Engineering, Physics or related field with academic or work experience in the related areas.
• The experience must include: SI/PI modeling, simulation, and optimization with simulation software such as SIwave, HFSS, ADS, and related.
• SI/PI/thermal impact on IC substrate design choices.
• Design experience with large form factor IC substrates.

Responsibilities

• Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing.
• Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams.
• In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware.
• System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements.
• Deliver and disseminate design milestones to stakeholders.
• Communicate designs in presentations and relevant documentation.
• Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers.

Skills

SI/PI packaging experience

Modeling & simulation

Cross-functional collaboration

Education

M.S. in Electrical Engineering or Physics or related field

Ph.D. in Electrical Engineering or Physics or related field

Tools

SIwave

HFSS

ADS

RaptorH/X

Job description

Intel Corporation in Oregon is seeking an experienced Quantum Packaging SI/PI Engineer to model and simulate packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team.

The role emphasizes SI/PI modeling, validation, and optimization using tools like SIwave, HFSS, and ADS. Collaboration with hardware teams and stakeholders is essential to meet ambitious quantum packaging goals in a fast-paced research environment.