Quantum IC Package Substrate Design Engineer

Intel Corporation; Hillsboro (OR); On-site; USD 122,000 - 173,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Oregon is seeking a Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team. The role focuses on designing large form factor IC substrates within a multidisciplinary team, advancing silicon quantum dot technology and scalable quantum systems.

You will work with Siemens Xpedition, engage with SI/PI/thermal analyses, and coordinate tapeouts with substrate suppliers, contributing to state-of-the-art packaging solutions and on-site

Qualifications

• B.S. or M.S. in Electrical/Computer Engineering with required experience.
• Experience with Siemens Xpedition and high-speed routing.
• Experience with large form factor IC substrates.

Responsibilities

• Design of IC substrates using Siemens Xpedition IC package design software.
• Collaborate with stakeholders to meet design requirements, e.g., receive feedback from silicon testchip, SI, PI, thermal, and system engineers.
• Deliver and disseminate design milestones to stakeholders.
• Design validation and verification; including DRC and LVS.
• Advanced packaging design integration (2.5D and 3D) with IC substrate.
• Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams.
• Communicate designs in presentations and relevant documentation.
• Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers.

Skills

Siemens Xpedition

High-speed routing

IC substrate design

2.5D/3D packaging

Tapeout coordination

SI/PI/thermal analysis

Communication/presentation

Education

Bachelor’s/Master’s in Electrical/Computer Engineering

Tools

Siemens Xpedition

Signal integrity tools

Job description

Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting‑edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide.

We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon.

In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing.

Key Responsibilities

• Design of IC substrates using Siemens Xpedition IC package design software
• Work closely with stakeholders to meet design requirements, e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers
• Deliver and disseminate design milestones to stakeholders
• Design validation and verification; including DRC and LVS
• Advanced packaging design integration (2.5D and 3D) with IC substrate
• Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams
• Communicate designs in presentations and relevant documentation
• Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers

As a successful candidate, you must possess

• Excellent communication and presentation skills for technical and non-technical audiences
• Strong analytical thinking and problem-solving capabilities
• Collaborative mindset with ability to work effectively across diverse teams
• Adaptability to work in a fast-paced, innovative research environment
• Passion for pushing the boundaries of quantum technology development

Minimum Qualifications

• B.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 5+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.
• OR M.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 3+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.

The experience must include:

• Siemens Xpedition design environment and workflow.
• High-speed signal routing.
• Experience with large form factor IC substrates.

Preferred Qualifications

• 1+ years of experience with advanced routing engines for IC substrate design. Examples include AI and physics/model-based routing engines.
• Proficiency with understanding SI/PI/thermal impact on IC substrate design choices.

Job Type: Experienced Hire

Shift: Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro

Additional Locations:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust: N/A

Benefits

• competitive pay
• stock bonuses
• benefit programs which include health, retirement, and vacation

Annual Salary Range for jobs which could be performed in the US: $122,440.00-172,860.00 USD

Work Model for this Role: This role will require an on-site presence.