Quantum Packaging Thermal Architect: Heat Design for Qubits

Intel

Hillsboro (OR)

On-site

USD 142,000 - 200,000

Full time

3 days ago

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Job summary

Intel Corporation's Quantum Computing Group in Oregon is seeking a Quantum Packaging Modeling Engineer responsible for thermal modeling and simulation of packaging solutions for silicon quantum dots, from redistribution layers to IC substrates. You will collaborate with cross-functional teams to advance silicon quantum dot technology and scalable quantum systems.

The role requires strong communication, analytical skills, and experience with thermal/mechanical modeling using Ansys Icepak or

Qualifications

MS degree in Electrical Engineering, Physics or related field with 5+ years in thermal modeling for packaging or related hardware.
OR PhD degree in Electrical Engineering, Physics or related field with relevant experience.
Experience with thermal/mechanical modeling and simulation using Ansys Icepak, COMSOL.
Understanding of packaging technologies and thermal integration.

Responsibilities

Perform thermal modeling and simulation of packaging hardware to analyze heat flow.
Lead integration of packaging hardware and enable co-design across stakeholders.
Collaborate with mechanical designers to define heat spreaders.
Deliver milestones to stakeholders and communicate designs.
Stay current with packaging tech by attending conferences and reading papers.