Quantum AI Wafer Bonding Engineer for 3D Integration

Google LLC; Goleta (CA); On-site; USD 159,000 - 230,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

Google Quantum AI is seeking a Wafer Bonding Process Engineer to lead TB/DB process development for next-gen quantum processors in Goleta, CA. You will drive development, integration, and release-to-production of temporary bonding, thinning, and debonding workflows, partnering with equipment vendors to bring up automated systems.

Responsibilities include establishing robust process controls to reduce wafer stress and warp, coordinating tool qualification, and mentoring technicians while

Qualifications

• Bachelor's degree in Electrical/Computer Engineering, Physics, or related field.
• 3 years in developing, sustaining, or integrating semiconductor processes in R&D or cleanroom environments.
• 3 years in temporary wafer bonding, laser/thermal debonding, thin wafer handling, or back-end packaging.

Responsibilities

• Lead TB/DB process development, integration, and release to production for next-gen quantum processors.
• Develop process flows with advanced adhesive chemistries and manufacturable debonding systems.
• Collaborate with vendors and cleanroom owners to qualify equipment and transition validated processes.
• Establish controls to mitigate wafer stress, bow, warp, and other integration issues on ultra-thin substrates.
• Troubleshoot anomalies, improve yield, and train cleanroom personnel on SOPs.

Skills

Wafer bonding

TB/DB processes

R&D cleanroom experience

Education

Bachelor's degree in EE/CE/CS/Physics

Tools

Wafer bonding equipment

Debonding equipment

3D integration tooling

Job description

Google Quantum AI is seeking a Wafer Bonding Process Engineer to lead TB/DB process development for next-gen quantum processors in Goleta, CA. You will drive development, integration, and release-to-production of temporary bonding, thinning, and debonding workflows, partnering with equipment vendors to bring up automated systems.

Responsibilities include establishing robust process controls to reduce wafer stress and warp, coordinating tool qualification, and mentoring technicians while