Quantum Packaging Engineer — 2.5D/3D & Cryogenic Tech

Google LLC; Goleta (CA); On-site; USD 150,000 - 230,000; Full time

Job summary

Google LLC is seeking an Advanced Packaging Development Engineer for the Quantum AI program in Goleta, CA. The role focuses on emerging packaging technologies to enable scaling of superconducting quantum processors and related components in cryogenic environments.

You will pioneer packaging methods such as 2.5D/3D integration and contribute to deployable solutions that align with Google Quantum AI's scaling roadmap.

Qualifications

• Bachelor’s degree or equivalent practical experience in EE/CE/Physics or related field.
• 5 years in packaging development across simulation, layout/design, process eng., assembly, test/measurement, or failure analysis.
• 5 years in 2.5D/3D integration, wafer level packaging, panel level packaging, or bump bonding.
• 3 years delivering R&D concepts to released products.
• 3 years developing advanced packaging solutions.

Responsibilities

• Design, architect, and implement novel packaging platforms.
• Characterize electrical, thermal, and mechanical properties of packaging materials.
• Develop and document new process flows and DfI principles for emerging tech.
• Lead engagements with external vendors to evaluate and qualify next-gen packaging processes.
• Conduct root cause analysis and mitigation for performance-limiting factors.

Skills

Electrical Eng

Computer Eng

Physics

Simulation tools

Layout and design

Process engineering

Assembly

Test and measurement

Failure analysis

2.5D/3D integration

Wafer level packaging

Panel level packaging

Bump bonding

R&D to product

Advanced packaging solutions

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics or related field

Tools

Simulation tools

Job description

Google LLC is seeking an Advanced Packaging Development Engineer for the Quantum AI program in Goleta, CA. The role focuses on emerging packaging technologies to enable scaling of superconducting quantum processors and related components in cryogenic environments.

You will pioneer packaging methods such as 2.5D/3D integration and contribute to deployable solutions that align with Google Quantum AI's scaling roadmap.