Wafer Bonding Process Engineer, Quantum AI

Google LLC; Goleta (CA); On-site; USD 159,000 - 230,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

Google Quantum AI is seeking a Wafer Bonding Process Engineer to lead TB/DB process development for next-gen quantum processors in Goleta, CA. You will drive development, integration, and release-to-production of temporary bonding, thinning, and debonding workflows, partnering with equipment vendors to bring up automated systems.

Responsibilities include establishing robust process controls to reduce wafer stress and warp, coordinating tool qualification, and mentoring technicians while

Qualifications

• Bachelor's degree in Electrical/Computer Engineering, Physics, or related field.
• 3 years in developing, sustaining, or integrating semiconductor processes in R&D or cleanroom environments.
• 3 years in temporary wafer bonding, laser/thermal debonding, thin wafer handling, or back-end packaging.

Responsibilities

• Lead TB/DB process development, integration, and release to production for next-gen quantum processors.
• Develop process flows with advanced adhesive chemistries and manufacturable debonding systems.
• Collaborate with vendors and cleanroom owners to qualify equipment and transition validated processes.
• Establish controls to mitigate wafer stress, bow, warp, and other integration issues on ultra-thin substrates.
• Troubleshoot anomalies, improve yield, and train cleanroom personnel on SOPs.

Skills

Wafer bonding

TB/DB processes

R&D cleanroom experience

Education

Bachelor's degree in EE/CE/CS/Physics

Tools

Wafer bonding equipment

Debonding equipment

3D integration tooling

Job description

Wafer Bonding Process Engineer, Quantum AI

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corporate_fare Google place Goleta, CA, USA

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
• 3 years of experience developing, sustaining, or integrating semiconductor fabrication processes in an research and development (R&D) or cleanroom production environment.
• 3 years of experience in temporary wafer bonding, laser/thermal debonding, thin wafer handling, or back-end packaging processes.

Preferred qualifications:

• Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP).
• Experience mitigating mechanical stress, bow, warp, and micro-cracking in ultra-thin silicon substrates, integrated with backside thinning and dicing-on-tape workflows.
• Experience executing 3D Integration technical roadmaps, executing complex development and process integration projects.
• Excellent collaborative leadership skills, and experience leading technical evaluations with equipment vendors, managing joint development projects, and cross-training/mentoring engineers and technicians.
• Expertise in polymer adhesives, temporary bonding materials, and release processes.
• Ownership qualifying automated temporary bonding, lamination, and laser/mechanical debonding tools.

About the job

Google Quantum AI is building quantum computing for otherwise unsolvable problems. The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.

In this role, you will lead the development, integration, and Release to Production of temporary wafer bonding, thinning, and debonding (TB/DB) processes for Google Quantum AI’s next-generation quantum processors. Responsibilities include developing and implementing process flows featuring advanced adhesive bonding chemistries, manufacturable debonding systems, and thin-wafer handling. You will partner with equipment vendors and cleanroom module owners to bring up automated bonding and debonding equipment, coordinate evaluation runs, and transition validated processes into baseline process flows for upcoming milestones. You will establish robust process controls to mitigate wafer stress, bow, warp, and other downstream process integration issues across ultra-thin substrates.

Individual pay is determined by factors including job-related skills, experience, and relevant education or training.

US: $159000 - $230000 (USD) + 15% bonus target + equity + benefits

Learn more about benefits at Google .

• Develop, integrate, and transition to production temporary adhesive bonding and laser debond processes and equipment for advanced 3D Integration of quantum devices..
• Specify, bring up, and qualify required clean room equipment and advanced metrology capabilities, establishing baseline operational recipes and documentation.
• Drive process integration activities around wafer thinning, thin-wafer handling, and stress/warp mitigation.
• Coordinate vendor evaluations, off-site demos, technology transfers, and Release to Production of tools and processesinto quantum device production processes.
• Troubleshoot processing anomalies, improve yield, and train cleanroom personnel and technicians on standard operating procedures.

Google is proud to be an equal opportunity and affirmative action employer. We are committed to building a workforce that is representative of the users we serve, creating a culture of belonging, and providing an equal employment opportunity regardless of race, creed, color, religion, gender, sexual orientation, gender identity/expression, national origin, disability, age, genetic information, veteran status, marital status, pregnancy or related condition (including breastfeeding), expecting or parents-to-be, criminal histories consistent with legal requirements, or any other basis protected by law. See also Google's EEO Policy , Know your rights: workplace discrimination is illegal , Belonging at Google , and How we hire .

Google is a global company and, in order to facilitate efficient collaboration and communication globally, English proficiency is a requirement for all roles unless stated otherwise in the job posting.

Equity is granted exclusively and discretionarily by Alphabet Inc. on the basis of an agreement concluded between you and Alphabet Inc. Alphabet Inc. is your sole contractual partner with respect to equity grants. GSU grants are not guaranteed, are discretionary, are subject to approval by the Alphabet Inc. board of directors or its delegate, the terms of the relevant Alphabet Inc. stock plan, and your grant agreement. They have no impact on statutory payments. Current or past grants do not confer an acquired right.