Lead Wafer Bonding & Advanced Packaging Architect

thrively; Santa Clara (CA); On-site; USD 180,000 - 280,000; Full time

Job summary

Thrively is seeking a Principal Wafer Bonding Integration & Packaging Engineer to own bonding integration, packaging development, and manufacturing transfer. You will collaborate across design, process development, and external foundries to enable scalable production of advanced semiconductor technologies.

The role demands deep expertise in wafer bonding technologies, process integration, and a product mindset to ensure manufacturability, reliability, and repeatable yields in high-performance AI

Qualifications

• BS, MS, or PhD in a relevant technical discipline.
• 10+ years of semiconductor product development and CMOS manufacturing experience.
• Hands-on experience with fusion, eutectic, hybrid, or direct wafer bonding.
• Experience taking technologies through NPI and manufacturing ramp.
• Strong DOE, SPC, and yield improvement expertise.

Responsibilities

• Own wafer bonding integration strategy from early product development through manufacturing ramp.
• Develop and optimize bonding processes (fusion, eutectic, hybrid, direct).
• Define bonding windows, alignment strategies, thermal budgets, and material compatibility.
• Drive surface preparation, cleaning, activation, CMP, and post-bond processing.
• Collaborate with packaging, process integration, and product engineering teams.
• Partner with design, process development, and foundries to establish manufacturing flows.
• Lead process transfer and qualification activities.
• Drive process readiness for new product introductions.
• Support engineering builds, qualifications, production ramps, and continuous improvement.
• Ensure bonding processes meet yield, quality, reliability, manufacturability, and schedule requirements.
• Coordinate with external manufacturing partners and foundries.

Skills

Wafer bonding

Process integration

Packaging development

Manufacturing transfer

Cross-functional collaboration

Education

BS/MS/PhD in Materials Science, Mechanical, Electrical, Physics

Tools

SEM

IR inspection

Profilometry

C-SAM

AFM

Job description

Thrively is seeking a Principal Wafer Bonding Integration & Packaging Engineer to own bonding integration, packaging development, and manufacturing transfer. You will collaborate across design, process development, and external foundries to enable scalable production of advanced semiconductor technologies.

The role demands deep expertise in wafer bonding technologies, process integration, and a product mindset to ensure manufacturability, reliability, and repeatable yields in high-performance AI