Senior Wafer Bonding Process Engineer

Bzpp; United States; On-site; USD 70,000 - 179,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

401(k) matching

Onsite facilities

Job summary

Samsung Austin Semiconductor is seeking an experienced engineer to provide technical leadership in wafer bonding and de-bonding. You will design experiments, analyze bonding quality, troubleshoot issues, and document process parameters for 24/7 operation.

You will lead equipment setup, maintain tool matching, and drive continuous improvement with cross-functional teams. The role requires at least 5 years in fab equipment and wafer bonding, with a Bachelor's in engineering.

Qualifications

• Bachelor's degree in Engineering or a related technical discipline.
• Minimum 5 years of Fab Equipment management experience.
• Minimum 3 years in wafer bonding and debonding equipment.
• Experience in the semiconductor environment or high-volume manufacturing.
• Strong problem-solving and data analysis skills.
• Ability to manage multiple projects and milestones.

Responsibilities

• Lead bonding equipment setup, operation, and maintenance.
• Troubleshoot bonding/debonding issues and implement corrective actions.
• Drive continuous improvement for bonding yield and throughput.
• Collaborate with cross-functional teams and vendors.
• Provide operator training and knowledge transfer.

Skills

Hybrid bonding

Data analysis

Project management

Teamwork

Clean room

Fast paced

Education

Bachelor's degree in Engineering or a related technical discipline

Tools

VBA

Python

R

SQL

Job description

Samsung Austin Semiconductor is seeking an experienced engineer to provide technical leadership in wafer bonding and de-bonding. You will design experiments, analyze bonding quality, troubleshoot issues, and document process parameters for 24/7 operation.

You will lead equipment setup, maintain tool matching, and drive continuous improvement with cross-functional teams. The role requires at least 5 years in fab equipment and wafer bonding, with a Bachelor's in engineering.