Quantum AI Packaging Engineer — 2.5D/3D & Cryogenic

Google; Goleta (CA); On-site; USD 159,000 - 230,000; Full time

Benefits offered by this job

Equity

Bonus target

Benefits

Job summary

Google is seeking an Advanced Packaging Engineer in Goleta, CA, to develop custom packaging for quantum processors and related devices. You will lead packaging projects from concept to deployment, focusing on 2.5D/3D integration and novel interconnects.

Responsibilities include evaluating electrical/thermal/mechanical performance, defining new process flows, and collaborating with RF and quantum teams to scale packaging for quantum computing systems.

Qualifications

• Bachelor’s degree in EE/CE/CS/Physics or equivalent experience.
• 5 years in 3+ packaging areas: simulation, layout/design, process engineering, assembly, test/measurement, failure analysis.
• 3+ years delivering RD concepts to a released product and developing advanced packaging.
• Experience with 2.5D/3D integration and wafer/panel level packaging.

Responsibilities

• Design, architect, and implement novel packaging platforms.
• Characterize electrical, thermal, and mechanical properties of packaging materials.
• Develop new process flows and Design-For-Integration (DfI) principles.
• Engage with external vendors to evaluate and qualify next-gen packaging.
• Conduct root cause analysis and mitigate performance-limiting factors.

Skills

Packaging development

R&D to product delivery

2.5D/3D integration

Wafer level packaging

Panel level packaging

Bump bonding

Simulation experience

Test & measurement

Failure analysis

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field

Master’s degree or PhD in Electrical Engineering, Computer Engineering, Physics, or related field

Tools

Simulation tools

Job description

Google is seeking an Advanced Packaging Engineer in Goleta, CA, to develop custom packaging for quantum processors and related devices. You will lead packaging projects from concept to deployment, focusing on 2.5D/3D integration and novel interconnects.

Responsibilities include evaluating electrical/thermal/mechanical performance, defining new process flows, and collaborating with RF and quantum teams to scale packaging for quantum computing systems.