Quantum Packaging Engineer: Die Dicing & Bonding

Amazon Inc.

Pasadena (CA)

On-site

USD 75,000 - 131,000

Full time

7 days ago

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Benefits offered by this job

Health insurance (medical, dental, and

401(k) matching

Paid time off

Parental leave

Job summary

Amazon Development Center U.S., Inc. in Pasadena, CA is seeking a Hardware Development Engineer with hands-on experience in semiconductor process development, die singulation, probing, wirebonding and flip chip bonding to advance quantum computing product chips.

You will work in the cleanroom and pursue reliable, scalable packaging and test methods. You will collaborate with cross-functional teams to analyze process data, improve yield, and implement standardized workflows that support rapid

Qualifications

2+ years of technical support experience.
2 years of direct microfabrication experience.
2 years experience with hands-on wafer level and die level handling, die cleaning, and optical inspection equipment.
Excellent communication and writing skills.

Responsibilities

Lead the sustainment and development of die singulation, die preparation, and device probing.
May need to support wirebonding, and flip chip bonding.
Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals.
Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations.
Analyze process data to identify trends, improve stability, and drive continuous yield improvement.