Packaging R&D Engineer: Advanced Substrate & Embedded Die

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Paid vacation

Job summary

Intel Corporation in Phoenix, AZ is seeking a Packaging Research and Development Engineer to lead process and material development for advanced substrate packaging technologies. The role involves heavy factory-floor interaction, equipment setup, and collaboration with suppliers to drive disruptive innovations in embedded die packaging.

The candidate should have strong communication skills, willingness to travel, and flexibility in roles and hours.

Qualifications

• Minimum qualifications include a Master’s degree in a relevant science or engineering field with 3+ years (or PhD with 1+ year).
• Experience in mechanical & materials engineering with materials characterization, design, reliability, and failure analysis.

Responsibilities

• Define and establish equipment configurations, process specs, and integrated process flow for new technologies.
• Plan and conduct DOEs to characterize process window and interactions.
• Drive continuous improvements in yield, reliability, quality, and cost.
• Lead cross-functional teams supporting substrate technology development.

Skills

DOE experience

Statistical analysis

Reliability assessment

Process troubleshooting

Education

Master's degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry

PhD in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry

Tools

Process equipment handling

SPC/JMP/JSL

Python

XPS/FTIR/SEM characterization

Job description

Intel Corporation in Phoenix, AZ is seeking a Packaging Research and Development Engineer to lead process and material development for advanced substrate packaging technologies. The role involves heavy factory-floor interaction, equipment setup, and collaboration with suppliers to drive disruptive innovations in embedded die packaging.

The candidate should have strong communication skills, willingness to travel, and flexibility in roles and hours.