Packaging Process Engineer Onsite: Innovation & Reliability

Intel; Phoenix (AZ); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health insurance

Retirement plan

Paid vacation

Job summary

Intel in Phoenix, AZ seeks a Packaging Module Development Engineer to advance assembly processes and equipment for future packaging technologies. You will optimize manufacturing, develop DOE-based experiments, and document improvements.

The role requires onsite presence; a PhD with 1+ years in DOE/SPC and semiconductor packaging experience is preferred, along with programming skills in Python or MATLAB.

Qualifications

• PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or related field with 1+ years of experience.
• 1+ years of experience applying statistical analysis techniques including Design of Experiments (DOE) and Statistical Process Control (SPC).
• 1+ years of experience in semiconductor manufacturing, packaging, materials engineering, or related advanced technology environments.

Responsibilities

• Develop and optimize packaging processes and equipment.
• Apply DOE/SPC and data-driven problem solving for root cause analysis.
• Collaborate with cross-functional teams to ensure quality, reliability and manufacturability.

Skills

DOE

SPC

Data analysis

Education

PhD in Mechanical/Materials/Electrical/Physics/related

Tools

Python

MATLAB

JMP

Minitab

Job description

Intel in Phoenix, AZ seeks a Packaging Module Development Engineer to advance assembly processes and equipment for future packaging technologies. You will optimize manufacturing, develop DOE-based experiments, and document improvements.

The role requires onsite presence; a PhD with 1+ years in DOE/SPC and semiconductor packaging experience is preferred, along with programming skills in Python or MATLAB.