Packaging Research and Development Engineer

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Paid vacation

Job summary

Intel Corporation in Phoenix, AZ is seeking a Packaging Research and Development Engineer to lead process and material development for advanced substrate packaging technologies. The role involves heavy factory-floor interaction, equipment setup, and collaboration with suppliers to drive disruptive innovations in embedded die packaging.

The candidate should have strong communication skills, willingness to travel, and flexibility in roles and hours.

Qualifications

• Minimum qualifications include a Master’s degree in a relevant science or engineering field with 3+ years (or PhD with 1+ year).
• Experience in mechanical & materials engineering with materials characterization, design, reliability, and failure analysis.

Responsibilities

• Define and establish equipment configurations, process specs, and integrated process flow for new technologies.
• Plan and conduct DOEs to characterize process window and interactions.
• Drive continuous improvements in yield, reliability, quality, and cost.
• Lead cross-functional teams supporting substrate technology development.

Skills

DOE experience

Statistical analysis

Reliability assessment

Process troubleshooting

Education

Master's degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry

PhD in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry

Tools

Process equipment handling

SPC/JMP/JSL

Python

XPS/FTIR/SEM characterization

Job description

## Packaging Research and Development EngineerApply: US, Arizona, Phoenix: Full time: Posted Today: JR0286710# **Job Details:**## Job Description:Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development to scale advanced substrate packaging technology to enable further die disaggregation / heterogenous integration. This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry. Responsibilities will include but not be limited to:- Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies - Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials interactions - Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity - Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development. The ideal candidate should exhibit the following behavioral traits and/or skills:- Written and verbal communication and teamwork skills. - Interact with equipment and materials suppliers. - Willingness to travel (some travel may be required, less than 5 percent) - Work with ambiguity and flexibility with respect to job roles and working hours is required.## **Qualifications:**You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.**Minimum qualifications:** The candidate must possess one of the following: * **Master's degree** in a relevant science or engineering discipline, preferably **Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry**, with **3+ years of related experience**; **or*** **PhD degree** in a relevant science or engineering discipline, preferably **Mechanical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry**, with **1+ year of related experience**. Experience listed below should be in any of the following:* **Mechanical & Materials Engineering:** Solid background in mechanical and materials engineering, with experience applying materials characterization, mechanical design principles, reliability assessments, and failure analysis to support advanced packaging and manufacturing technology development.* **Advanced Packaging & Manufacturing Development:** Experience developing semiconductor packaging, substrate, embedded die, or heterogeneous integration technologies, including hands-on work with process equipment, factory operations, and equipment suppliers.* **Process Characterization & Optimization:** Expertise in DOE, statistical analysis, process development, root cause investigation, and driving improvements in yield, reliability, quality, and process capability.**Preferred qualifications:**1+ years of experience in the following: - Research & Innovation Experience: Experience conducting research in semiconductor packaging, materials, manufacturing processes, or related fields - Engineering troubleshooting and analytical skills on integrated technology issues and experience working with broad team of other process and integration engineers. - Experience owning process tools with knowledge of SPC PCS RFCs equipment troubleshooting statistical design of experiments and process development. - Experience working with a variety of organic/inorganic materials and processes as well as characterizations utilizing techniques such as DSC, TGA, D/TMA, Titration, ICPMS, FTIR, XPS, TOFSIMS, EDX, SEM, etc. is highly desirable. - Experience with statistical data analysis, JMP and JSL, Python, relational database structure and usage, machine learning. Become part of Intel's innovative team and take the next step in your career by applying today.## Job Type:Experienced Hire## Shift:Shift 1 (United States of America)## Primary Location:US, Arizona, Phoenix## Additional Locations:## Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.## ## Position of TrustN/A## BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.**Work Model for this Role**This role will require an on-site presence. \\* Job posting details (such as work model, location or time type) are subject to change.