Advanced Packaging Metrology & Software Engineer

Intel Corporation; Phoenix (AZ); On-site; USD 115,000 - 220,000; Full time

Job summary

Intel Corporation in Chandler, Arizona seeks a Packaging Module Development Engineer. The role blends metrology, data analytics, and software development to optimize metrology recipes and transform equipment data into actionable insights.

Develop desktop applications with Python frameworks or C#/.NET, manage full software lifecycle, and collaborate with suppliers and cross-functional teams to drive yield and throughput.

Qualifications

• Full software development lifecycle experience including requirements, architecture, coding, testing and documentation.
• Experience using Python or C#/.NET to build desktop applications or scientific software.
• Knowledge of data science tools, SQL, visualization, SPC, and DOE.

Responsibilities

• Design, code, test, deploy, and maintain desktop applications and automation scripts.
• Own the full software lifecycle from requirements to maintenance.
• Develop, qualify, and optimize packaging inspection recipes and processes.
• Create data pipelines, perform statistical analysis, and write results to SQL databases.

Skills

Python

C#/.NET

Desktop apps

Data science

Education

Bachelor’s degree in Engineering

Master’s degree in a matching STEM discipline

PhD in a matching STEM discipline

Tools

PyQt

Tkinter

NumPy

Pandas

Job description

Intel Corporation in Chandler, Arizona seeks a Packaging Module Development Engineer. The role blends metrology, data analytics, and software development to optimize metrology recipes and transform equipment data into actionable insights.

Develop desktop applications with Python frameworks or C#/.NET, manage full software lifecycle, and collaborate with suppliers and cross-functional teams to drive yield and throughput.