Media & Collateral Packaging Engineer

Intel

Phoenix (AZ)

On-site

USD 85,000 - 120,000

Full time

2 days ago

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Benefits offered by this job

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Retirement plan

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Job summary

Intel in Phoenix, AZ is seeking a Packaging Module Development Engineer to shape the development and optimization of assembly media and collaterals. You will design solutions to improve reliability, manufacturability, and cost efficiency across the packaging technology roadmap.

Join Intel's Media Development group to advance semiconductor packaging processes, apply DOE and SPC techniques, and contribute to high-impact projects with cross-functional teams in an on-site setting.

Qualifications

Bachelor's degree in mechanical engineering or related field with 6 months of hands-on experience.
Experience in Equipment Engineering, Mechanical Design and/ or Process Engineering.
Not eligible for Intel immigration sponsorship.

Responsibilities

Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets.
Design and implement new media and collateral solutions, leveraging DOE and SPC.
Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces.
Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods.
Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones.
Document technical improvements and innovations through research papers and presentations.