Packaging Module Development Engineer – Semiconductors

Intel Corporation; Chandler (AZ); On-site; USD 85,000 - 163,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Benefits: health, retirement, and paid

Job summary

Intel Corporation in Arizona is seeking a Packaging Module Development Engineer to join our Epoxy MEOS team. You will develop and optimize assembly and packaging processes for next-generation semiconductor products.

This is an exciting early-career role to apply academic knowledge in a world-class manufacturing environment, contribute to meaningful projects, and grow alongside some of the brightest minds in the semiconductor industry.

Qualifications

• Bachelor’s degree in mechanical engineering, materials science engineering, chemical engineering, electrical engineering, applied technology or a related field with 2+ years of hands-on experience in assembly and packaging technologies or technology manufacturing.

Responsibilities

• Design and develop assembly packaging processes and equipment to enable next-generation semiconductor technologies.
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Skills

Curiosity & eagerness to learn

Collaborative spirit

Problem-solving mindset

Attention to detail

Effective communication

Adaptability

Ownership & accountability

Statistical thinking

Education

Bachelor’s degree in mechanical engineering, materials science, chemical engineering, electrical engineering, applied technology

Tools

Python

JMP

Minitab

Laser systems

Job description

Intel Corporation in Arizona is seeking a Packaging Module Development Engineer to join our Epoxy MEOS team. You will develop and optimize assembly and packaging processes for next-generation semiconductor products.

This is an exciting early-career role to apply academic knowledge in a world-class manufacturing environment, contribute to meaningful projects, and grow alongside some of the brightest minds in the semiconductor industry.