Senior Advanced Packaging Module Engineer

Intel Corporation; Hillsboro (OR); On-site; USD 89,000 - 126,000; Full time

Benefits offered by this job

Stock bonuses

Health insurance

Retirement plan

Vacation

Job summary

Intel Corporation in Hillsboro, Oregon, seeks a Module Engineer to own high-volume packaging equipment and drive process development and control. You will work on cutting-edge semiconductor packaging, ensuring manufacturability and high-quality output.

The role emphasizes cross-functional leadership, problem solving with data, and adapting to a fast-paced manufacturing environment, with on-site work and strong career growth opportunities.

Qualifications

• Bachelor’s degree in Electrical Engineering, Physics, Mechanical Engineering, Chemical Engineering, Materials Science, Chemistry or related STEM with 1+ years hands-on semiconductor manufacturing or high-tech process equipment.
• Master’s degree in a matching STEM discipline is acceptable as alternative.

Responsibilities

• Own high-volume packaging equipment and manage processes for HVM manufacturability.
• Develop and monitor process control and inline metrology.
• Coordinate technology transfer with global Intel sites and training.
• Lead continuous improvement initiatives focused on safety, quality, productivity, and cost reduction.
• Coordinate equipment installations, conversions, and qualifications during factory ramps.
• Collaborate with suppliers to optimize tool configurations and materials.

Skills

Technical leadership

Problem-solving

Adaptability

Attention to detail

Statistical analysis tools

Education

Bachelor’s degree in STEM with 1+ years experience

Master’s degree in STEM

Tools

JMP

SQL

Job description

Intel Corporation in Hillsboro, Oregon, seeks a Module Engineer to own high-volume packaging equipment and drive process development and control. You will work on cutting-edge semiconductor packaging, ensuring manufacturability and high-quality output.

The role emphasizes cross-functional leadership, problem solving with data, and adapting to a fast-paced manufacturing environment, with on-site work and strong career growth opportunities.