Packaging Media & Collateral Innovation Engineer

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 85,000 - 120,000; Full time

Benefits offered by this job

Health insurance

Stock bonuses

Retirement plan

Paid vacation

Job summary

Intel Corporation in Phoenix, AZ is seeking a Packaging Module Development Engineer to advance media and collateral solutions for assembly packaging. You will design, test, and optimize media reliability, cost, and manufacturability, and apply DOE and SPC to drive improvements.

You will lead efforts to mitigate quality risks, consult on technical challenges, and document innovations for internal reviews and knowledge sharing.

Qualifications

• Bachelor's degree in mechanical engineering or related field with 6 months of hands-on experience.
• Experience in Equipment Engineering, Mechanical Design and/or Process Engineering.
• Preferred: SolidWorks or AutoCAD; portfolio of self-completed projects; familiarity with semiconductor packaging processes.

Responsibilities

• Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets.
• Design and implement new media and collateral solutions using DOE and SPC.
• Evaluate media and collaterals under simulated field conditions (heat, humidity, temperature cycling, dynamic forces).
• Lead initiatives to identify and mitigate media and collateral quality and reliability risks.
• Provide technical consultation and deliver solutions aligned with milestones; document improvements through papers and presentations.

Skills

Technical analysis

Project delivery

DOE

SPC

Education

Bachelor's degree in mechanical engineering

Tools

SolidWorks

AutoCAD

Job description

Intel Corporation in Phoenix, AZ is seeking a Packaging Module Development Engineer to advance media and collateral solutions for assembly packaging. You will design, test, and optimize media reliability, cost, and manufacturability, and apply DOE and SPC to drive improvements.

You will lead efforts to mitigate quality risks, consult on technical challenges, and document innovations for internal reviews and knowledge sharing.